2026年11月12日
実装,DIS/設計,モビリティ,半導体・電子部品関連,自動車・モビリティ関連企業
| 時間 | 内容 |
| 12:00 | 受付 ネットワーキングランチ |
| 13:00 | Keynotes ・Welcome by Patrick Vandenameele, CEO at imec ・Welcome by METI ・Welcome by Mr. Taniguchi, R&D Director at ASRA ・Welcome by RISE-A ・SDV to ADV and its Semiconductors by Mr. Taniguchi, R&D Director at ASRA ・Update on AECP by Bart Placklé, SVP automotive at imec ・Title TBC by Andy Powell, ARM ・Title TBC by Christian Sauer, LGE/Synopsis |
| 15:00 | 休憩・ネットワーキング |
| 16:00 | Keynotes ・Bringing chiplet-based architectures to market by Artem Aginskiy, TI ・From FCSA to Physical AI: Building an Open Reference Platform for the Autonomous Edge by Junie Um, Cadence ・Title TBC by Thaddeus Fortenberry, Tenstorrent ・Title TBC by Thomas Schamm, Bosch ・Inspired by the human brain - How chiplets van solve challenges in the automotive industry by Frank Moesle, Valeo |
| 19:00 | ネットワーキングディナー |
| 時間 | 内容 |
| 8:30 | 受付 |
| 9:00 | Keynotes Title TBC by Soshun Arai, Tier IV Title TBC by Toshifumi Iwasaki, Socionext |
| 10:40 | 休憩・ネットワーキング |
| 11:10 | Panel on standardization |
| 12:00 | ランチ |